◎ 반도체 : Flip Chip, BGA, QFT, TBGA, FBGA, SOP, FET, MLCC, PCB
◎ 산업용 : ITO Target, Wafer, Pipe, Plate, Bar, 복합소재, 피스톤검사, 도금결함판별, 자동차엔진, 용접부
◎ 기본 표준형 SAM장비
◎ 표면 및 내부결함(Debonding, Delamination, Crack) 크기, 위치 및 소재의 두께 측정
◎ 고성능의 리니어 서보모터 사용. 저소음, Natural scanning 및 신호대잡음비 향상
◎ 고품질의 스캐닝 이미지
◎ A, C, T Scan
| 1. Ultrasonic Pulser/Receiver |
| Frequency Range : 1 - 500MHz |
| Low noise, high performance pulser/receiver derives the ultrasonic signal of ultra wide-bandwidth characteristics from the transducer. |
| 2. A/D Converter |
| Real time 1GHz(8Bit) or 1.8GHz(12Bit) |
| 3. Mechanical Scanner |
| Scan Axis (Linear servo motor) |
Max. Stroke 350mm Max. Speed 1,000mm/s Repeatability +/-0.5 micron Encoder Resolution 0.5micron |
| Index Axis |
Micro-stepping motor with lead screw Max. Stroke 350mm Step Resolution 0.5micron |
| Vertical Axis |
Micro-stepping motor with lead screw Max. Stroke 70mm Vertical Resolution 2.5micron |
| 4. General |
| Water circulation pump with filter |
| Immersion Tank Dimension |
500mm x 520mm x 100mm |
| C- Scanning Area with T-Scan |
C-Scan : 350mm X 350mm X 80mm
T-Scan : 350mm X 130mm X 80mm
|
| Main Unit SIZE |
970mm X 900mm X 1350mm |
| Weight |
Approx. 350kg |
| Power |
AC220V / 20A |
|
종류
