◎ 반도체 : BGA, QFT, TBGA, FBGA, SOP, FET, MLCC, PCB
◎ 산업용 : ITO Target, Wafer, Pipe, Plate, Bar, 복합소재, 피스톤검사, 도금결함판별, 용접부
◎ 합리적인 가격으로 설계된 최소형 SAM 장비.
◎ 표면 및 내부 결함(Debonding, Delamination, Crack) 크기, 위치 및 소재의 두께 측정.
◎ 고품질의 스캐닝 이미지
◎ MINITM EMC와 IC패키지 검사에 적합
◎ A, C, T Scan
| 1. Ultrasonic Pulser/Receiver |
| Frequency Range : 1 - 150MHz |
| Enough frequency bandwidth to inspect the most of IC’s packages with EMC. |
| 2. A/D Converter |
| Real time 1GHz Sampling Rate, 8bits |
| 3. Mechanical Scanner |
| Scan Axis (Linear servo motor) |
Max. Speed 750mm/s Repeatability +/-1 micron Encoder Resolution 0.5 micron |
| Index Axis |
Micro-stepping motor with lead screw, Step Resolution 1 micron |
| Vertical Axis |
Micro-stepping motor with lead screw, Max. Stroke 80mm, Step Resolution 1 micron |
| 4. General |
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| Immersion Tank Dimension |
430mm X 410mm X 90 |
| C- Scanning Area with T-Scan |
C-Scan : 350mm X 170mm X 80mm
T-Scan : 350mm X 130mm X 80mm
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| Main Unit SIZE |
720mm X 740mm X 490mm |
| Weight |
Approx. 80kg |
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종류
