SAM-DENEB
Scanning Acoustic Microscope for Semiconductor and Industrial Materials.
Kind :   SAM Products



◎ Semiconductor : Flip Chip, BGA, QFT, TBGA, FBGA, SOP, FET, MLCC, PCB
◎ 
Industrial : ITO Target, Wafer, Pipe, Plate, Bar, complex Material, Piston test, Flaw detection in Planting, Car Engine, Weld zone





◎ The basic standard type SAM eqipment
◎ Measure the thickness of materials
◎ Measure the location and the size of flaw(Debonding, Delamination, Crack) inside materials and on the surface
◎ Low noise by using the highly efficient linear-servo motor
◎ High quality and accurate scanning image
◎ A, C, T Scan




 
1. Ultrasonic Pulser/Receiver
Frequency Range : 1 - 500MHz
Low noise, high performance pulser/receiver derives the ultrasonic signal of ultra wide-bandwidth characteristics from the transducer.

 

2. A/D Converter
Real time 2GHz Sampling Rate , 1GHz Bandwidth

 

3. Mechanical Scanner
Scan Axis (Linear servo motor) Max. Stroke 350mm Max. Speed 1,000mm/s Repeatability +/-0.5 micron Encoder Resolution 0.5micron
Index Axis Micro-stepping motor with lead screw Max. Stroke 350mm Step Resolution 0.5micron
Vertical Axis Micro-stepping motor with lead screw Max. Stroke 70mm Vertical Resolution 2.5micron

 

4. General
Water circulation pump with filter
Immersion Tank Dimension 500mm x 520mm x 100mm
C- Scanning Area with T-Scan 350mm X 350mm X 70mm
Main Unit SIZE 950mm X 900mm X 1350mm
Weight Approx. 250kg
Power AC220V / 20A